Boyd Venture Challenge – Spring 2023
The Boyd Venture Challenge is a seed-fund grant competition conducted in the spring semester each year. Companies are awarded up to $30,000 in startup capital. Funds may be awarded to one company or split among several companies
Monday, Apr 10
Application Period Opens
Visit to apply.
Sunday, Apr 23
Application Period Closes at 11:59 pm
Visit for application details.
Friday, Apr 28
Invitation to Pitch
Friday, May 05
Pitch to the Judges
Wednesday, May 10