Boyd Venture Challenge – Spring 2023
The Boyd Venture Challenge is a seed-fund grant competition conducted in the spring semester each year. Companies are awarded up to $30,000 in startup capital. Funds may be awarded to one company or split among several companies
Monday, Apr. 10
Application Period Opens
Visit to apply.
Sunday, Apr. 23
Application Period Closes at 11:59 pm
Visit for application details.
Friday, Apr. 28
Invitation to Pitch
Friday, May. 05
Pitch to the Judges
Wednesday, May. 10